The development of science and technology not only improved people's living standards, but also caused major changes in the form of the conference. A paperless conference system emerged. One of the more representative forms of conferences is called hand-in-hand conference system. This type of conference uses equipment such as hand-in-hand microphones to reduce the waste of resources to a certain extent, and also helps to improve the efficiency of the conference. So what is the difference between a hand-in-hand conference system and a traditional conference system?
First, Xiaobian will introduce the traditional conference system. It usually uses wired microphones or wireless microphones, as well as professional conference audio equipment to help participants understand the speeches of the speakers. However, when the number of speakers increases, they need to pass the microphone to speak. If there are a large number of speakers, it is very inconvenient for the conference organizer to prepare multiple microphones. In addition, unlike the hand-in-hand microphone connection, the microphone connection in the traditional conference is radial, that is, the microphone cable starts from the mixer, and several microphones are connected to the microphone at the end.
In the actual use of the microphone connection mode of the traditional conference, it is easy to cause certain troubles for the participants. For example, because the microphone cable is more and more complicated, it is easy to pull, entangle, knot, and difficult to manage; it is relatively troublesome to repair after the fault occurs. In order to solve the shortcomings of the traditional form of meeting, a paperless conference system came into being. The hand-in-hand microphone used in the hand-in-hand conference system can solve these problems and give the participants the trouble of the traditional conference. So what are the characteristics of the hand-in-hand conference system? What are the magical features of this paperless conference system? Is the hand-held microphone really so good? Then the small series will introduce the hand-in-hand conference system in detail in the next paragraph. Characteristics.
The main components of the hand-in-hand conference system are conference host, hand-in-hand microphone, built-in power supply and imported high-quality super-capacitive capacitive poles, which are an important part of the hand-in-hand conference system. The conference host acts like a computer's mainframe. It controls all the devices in the hands-on conference system and uses the built-in power supply to power it. The person who organizes the meeting must be proficient in using the meeting host, otherwise he will not be able to present the meeting content perfectly for the attendees. The hand-in-hand microphone is an important tool for the participants to transmit information. Therefore, the conference organizer must check the usage of the hand-held microphone before the meeting starts to prevent the meeting from proceeding normally. After all the equipments have been checked, the conference organizer should set the host to the "OPEN" full open mode. All the representative units in the system can be opened and closed freely, regardless of the open unit.
Cheap 12 Layers PCB stackup and thickness
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The 12-layer board can usually be manufactured smoothly on a 1.6mm thick FR-4 board. But we've seen more 14- to 16-layer boards are being fabricated into 1.6mm thick boards, but the number of manufacturers that can produce them is limited to manufacturers that can produce HDI PCB boards. Those who can produce HDI Circuit boards are increasing.
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12 layer PCB stackup and thickness
12 Layer PCB Stack Up
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Preâ€Preg †1 x 2116
Layer 2 & 3 †0.13mm Frâ€4 Core with 35um/35um Copper
Preâ€Preg †1 x 2116
Layer 4 & 5 †0.13mm Frâ€4 Core with 35um/35um Copper
Preâ€Preg †1 x 2116
Layer 6 & 7 †0.13mm Frâ€4 Core with 35um/35um Copper
Preâ€Preg †1 x 2116
Layer 8 & 9 †0.13mm Frâ€4 Core with 35um/35um Copper
Preâ€Preg †1 x 2116
Layer 10 & 11 †0.13mm Frâ€4 Core with 35um/35um Copper
Preâ€Preg †1 x 2116
Bottom Layer †18um Copper Foil (plated to 35um+)
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I use this stackup a lot, provides GND shielding of high speed signals and has tightly coupled Power-Ground planes:
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12 layer PCB stackup thickness
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