BGA-encapsulated memory can improve the memory capacity by two to three times when the memory size is constant. Compared with TSOP, BGA has a smaller size, better heat dissipation performance and better electrical performance. The BGA packaging technology has greatly increased the storage capacity per square inch. The memory products using the BGA packaging technology have the same volume and only one third of the size of the TSOP package. In addition, the BGA package is compared with the traditional TSOP packaging method. There are faster and more effective ways to dissipate heat.
This article mainly explains how to remove the bga packaged cpu and replace it.
How to remove the bga package cpu_ step tutorial explain1, workbench
2, remove the chip with a wind gun
3, suction tin clean up the pad
4, chip loading docking station
5, fastening screws
6, brush uniform solder paste
7, ready to solder ball
8, align the ball net
8, corresponding to the pad into the solder ball
9, let go
10, remove the stencil
11, slowly heating with air gun
12. Solder ball completes ball rolling
13, installed preheater for good chip position
14, start up and down together
15, gently move the chip with a tweezers, feel the welding effect
16, welding is completed
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