At the exhibition, the company showed the special high-density "high-density" display LED chip, outdoor "highlight" display-specific LED chip and red light chip for the display market. In 2014, the trend of high-density HD and outdoor surface-mounting in the display market was very obvious. In order to meet the technical requirements of high scanning, high refresh and high gray level brought by high density of display, the future development direction of the chip is high consistency of wavelength and brightness, and strong resistance to back pressure and current impact. In order to cope with the development trend of high-definition labeling for outdoor display development, the chip will develop toward a trend of high brightness, good light type and strong weather resistance. Huacan Optoelectronics will continue to plow in the display market and adjust its product strategy according to market and customer needs.
For the lighting and backlight market, the company has demonstrated a series of high-performance, flexible and high-voltage LED chips "ç† " series, good anti-ESD capability and consistency of the backlight LED chip "can" series, low voltage, high brightness, high stability Flip-chip LED chip "Yao" series, full-angle LED filament chip "Can" series of four series, Huacan Optoelectronics has accumulated its rich experience in multi-production display products for the backlight and lighting market, and "Customized personalized requirements for customers" as the goal, collaborative development with customers to better meet the needs of the end market.
As the only LED chip manufacturer to participate in this exhibition, Huacan Optoelectronics has made a special appearance in 91m2, attracting new and old customers to visit and exchange, sharing technology research and development achievements at the forefront of the industry, and exploring future technological development trends. Huacan Optoelectronics focuses on the "core" world and insists on expanding the white light market on the basis of deep-growing the display market. The company will cooperate with packaging customers and application customers to carry out system innovation from the application, equipment, materials, structure and process methods. Provide customers with customized chip-level solutions.

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