In the LED production process, the epoxy resin (Epoxy) used is one of the key materials for the LED industry chain production products. Epoxy resin is a kind of organic polymer compound which contains two or more epoxy groups in a molecule, and their relative molecular qualities are not high except for a few. The molecular structure of the epoxy resin is characterized by the presence of an active epoxy group in the molecular chain, and the epoxy group may be located at the end, in the middle or in a ring structure of the molecular chain. Since the molecular structure contains an active epoxy group, they can be cross-linked with various types of curing agents to form an insoluble, infusible polymer having a three-dimensional network structure. In order to maintain the airtightness of the LED chip itself, protect the die from external corrosion, prevent moisture from entering the outside, mechanically support the wire, effectively discharge the heat generated inside, and prevent the electronic component from being mechanically vibrated. The impact is broken, resulting in a change in the characteristics of the component, using different shapes and material properties (with or without a dispersant), functioning as a lens or diffusing lens, providing a form that can be held by hand.
LED curing temperature and time with sealing resin is a very important factor. The main points include the following aspects: the general LED sealing resin hardener is acid anhydride, the hardening temperature is about 120-130 ° C; the hardening time is shortened after the accelerator is added. Regarding the hardening time and the phenomenon of hardening and hardening, the thermal conductivity of the resin is small, the internal hardening heat accumulation affects the hardening rate (reaction rate), and the inner (hardening heat) outside (oven) high heat disply case is easily deformed. The blending ratio and characteristics of the resin and the hardener: the amount of the hardener used depends on the desired properties; when the blending ratio of the hardener is small, the hardness of the hardened material is hard and yellow; when the blending ratio of the hardener is large, the hardened material becomes brittle and Less coloring.
The epoxy resin used to form the envelope must have moisture resistance, insulation, and mechanical strength, and has a high refractive index and transmittance for emitting light to the LED. The choice of encapsulation materials with different refractive indices, the influence of package geometry on photon and escape efficiency is different. The angle of illumination intensity is also related to the structure of the die, the way of light output, and the material and shape of the package lens. If a pointed resin lens is used, the light can be concentrated in the axial direction of the LED, and the corresponding viewing angle is small; if the resin lens at the top is circular or planar, the corresponding viewing angle will increase.
(Edit: Technology)
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