[Text|High-tech LED reporter Lu Qiujia] LED lighting products as the fourth generation of new light sources, has begun to gradually occupy the market of incandescent lamps and energy-saving lamps.
However, in general, this replacement process has just begun. It takes time to popularize LED lamps, and there are still many unfavorable factors, such as heat dissipation and light effects.
LED luminaires have realized the innovation of light source, but how to realize the supporting innovations in materials, structure and appearance modeling lamps, so that the luminaire best reflects the effect of the light source, and it is easier for the majority of users to accept, which is a topic worthy of attention.
In general, LED lamps work stably, quality is good, and the heat dissipation of the lamp body itself is very important. The structure of the LED lamp is generally composed of the LED light source connected to the heat dissipation structure, the driver and the lens, so the heat dissipation is also an important part, if the LED cannot Very good heat dissipation, its life will also be affected.
The LED packaging industry has experienced traditional SMD, last year's COB device volume, and then the recent EMC package products, flip-chip package products burst. Every innovation in packaging technology provides a more flexible design space for luminaire manufacturers.
Shenzhen Keshida Photoelectric Co., Ltd. is a comprehensive enterprise integrating OEM, ODM manufacturers integrating R&D, design, production and sales of LED light source and LED lighting. After more than ten years of technical accumulation, COS-TECH (Chip On Submount), a packaging technology for the LED field, has been successfully developed.
Conventional packaging forms a light source component for LED applications by attaching multiple discrete devices to a PCB. The mirrored aluminum (or gold-plated, silver-plated) used in the COS-TECH package acts as a thermally conductive substrate that combines thermal and efficient reflection.
He Zhongliang, general manager of Keshida Optoelectronics, said: "This technology has broken through the thermal bottleneck of LEDs, increased luminous efficiency, reduced material costs, and reduced thermal design costs."
At present, the products of Austin COSLED include indoor commercial products such as lamps, downlights, panel lights and spotlights.
The "Intelligent Lighting and O2O Channel Special Session" held in conjunction with the 2014 High-tech LED Exhibition will be held on September 27th from 14:00-17:30 in the Guangzhou Pazhou Canton Fair.
At that time, He Zhongliang, the general manager of Shenzhen Keshida Optoelectronics Co., Ltd. will explain to you how the third generation packaging technology COSTECH will bring changes to the lighting design.
However, in general, this replacement process has just begun. It takes time to popularize LED lamps, and there are still many unfavorable factors, such as heat dissipation and light effects.
LED luminaires have realized the innovation of light source, but how to realize the supporting innovations in materials, structure and appearance modeling lamps, so that the luminaire best reflects the effect of the light source, and it is easier for the majority of users to accept, which is a topic worthy of attention.
In general, LED lamps work stably, quality is good, and the heat dissipation of the lamp body itself is very important. The structure of the LED lamp is generally composed of the LED light source connected to the heat dissipation structure, the driver and the lens, so the heat dissipation is also an important part, if the LED cannot Very good heat dissipation, its life will also be affected.
The LED packaging industry has experienced traditional SMD, last year's COB device volume, and then the recent EMC package products, flip-chip package products burst. Every innovation in packaging technology provides a more flexible design space for luminaire manufacturers.
Shenzhen Keshida Photoelectric Co., Ltd. is a comprehensive enterprise integrating OEM, ODM manufacturers integrating R&D, design, production and sales of LED light source and LED lighting. After more than ten years of technical accumulation, COS-TECH (Chip On Submount), a packaging technology for the LED field, has been successfully developed.
Conventional packaging forms a light source component for LED applications by attaching multiple discrete devices to a PCB. The mirrored aluminum (or gold-plated, silver-plated) used in the COS-TECH package acts as a thermally conductive substrate that combines thermal and efficient reflection.
He Zhongliang, general manager of Keshida Optoelectronics, said: "This technology has broken through the thermal bottleneck of LEDs, increased luminous efficiency, reduced material costs, and reduced thermal design costs."
At present, the products of Austin COSLED include indoor commercial products such as lamps, downlights, panel lights and spotlights.
The "Intelligent Lighting and O2O Channel Special Session" held in conjunction with the 2014 High-tech LED Exhibition will be held on September 27th from 14:00-17:30 in the Guangzhou Pazhou Canton Fair.
At that time, He Zhongliang, the general manager of Shenzhen Keshida Optoelectronics Co., Ltd. will explain to you how the third generation packaging technology COSTECH will bring changes to the lighting design.
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