Dialog Tongwei: IoT explosive growth, support for multiple communication protocols is king

Mr. Tong Wei, Product Marketing Manager of Dialog Semiconductor Company, recently gave a speech on “The Orientation of Internet of Things” in a forum. He said that the Internet of Things market is growing rapidly. By 2020, there will be 3 billion smartphones, 1.5 billion smart cars, and 10 devices or accessories for everyone to install apps. So there will be 50 billion wireless devices in the world. equipment. We all know that the Internet of Things frenzy is coming, and the market will grow with very large demand.

According to market research data from IHS and IDC, by 2019, wearable device shipments will triple, with a compound annual growth rate of 63%. Among them, fitness or general smart bracelets account for 50% of the market share. While smart watches and smartphones are 1:19 in 2015, they will become 5:1 in 2019.

As for the smart home segment, its related application products have been brewing in the market, and the industrial ecology is also being established. The application of low-power wireless communication chips or products will increase by about 3.5 times in 2014 compared with 2014.

The current IoT communication protocol is numerous and complicated.

The architecture of the Internet of Things can be divided into three layers to illustrate. The typical IoT architecture is the End Node from the first layer. These node devices (such as smart bracelets, smoke detectors, vehicle tracking, factory/business/school/hospital senses) Both measurement and monitoring) have the ability to sense and collect data, with simple data processing and small data transfer capabilities, which can transfer data to a second-tier Gateway device (such as a router or smartphone). After the data is aggregated, it is sent to the third layer of the cloud for big data applications.

Regarding the transmission mode of the second layer and the third layer, the industry can solve the problem by using wired (Ethernet) or wireless (3G/4G) communication, but the first layer and the second layer? If we carefully explore the communication between the first layer of End Node and the second layer of Gateway, we can find that there are too many communication protocols and industry standards. Such as enocean, HomeKit, ZigBee, Wi-Fi, ULE, Thread, Bluetooth, NEST, SmartThings, ZWAVE, IEEE 802.15.4, UPB, KNX, X10, LonWorks, AllJoyn, etc. In the face of such a large and messy communication protocol and ecosystem, how do consumers and developers choose in these minefields?

Let's talk about the overlord of Google and Apple's two mobile device platforms, each with its own specifications. For example, after Google acquired Nest, it began to promote its Thread agreement, and related products will be listed one after another. Apple's HomeKit and HealthKit are based on Bluetooth and Wi-Fi. As for the Samsung's acquisition of SmartThings is based on ZigBee. Huawei, Xiaomi and other vendors choose Bluetooth/Wi-Fi and even ZigBee.

Can support multiple protocols is the king of the Internet of Things

Since all major manufacturers have already made the above decisions, it seems that they have to face so many transmission protocols and standards, such as Wi-Fi, Bluetooth, 802.15.4, ZigBee and Thread, in order to enter the Internet of Things market. Each transmission protocol has its advantages and application scenarios. As a developer or consumer, is there a solution on the market that can all be supported?

Tong Wei said that Dialog semiconductor products include power management ICs (PMICs), audio chips, LED driver ICs, power conversion chips, communication chips, and so on. Due to Dialog's strength, it is to provide a variety of ultra-low power wireless SoC product portfolio, with multiple sensor fusion, energy harvesting, audio and other technologies have also been innovative, coupled with the need for low power consumption, small size, low system for today The cost of IoT products has been optimized, and the various reference design products provided by Dialog can support a wide range of IoT applications, which can meet the needs of developers for high integration and easy import when developing IoT products.

Dialog's SmartBond family of energy-saving ICs, including the DA1458x and DA1468x series. The DA1458x is a single-chip solution that combines PMU, DC-DC, and LDO units with ultra-low power consumption for low-cost, lightweight devices. Like Proximity Tag, Beacon, smart buttons, disposable devices, and more. DA14580 has been used by Murata, Panasonic, TDK, ALPS, LG-innotech, Samsung (SEMCO) and other manufacturers to produce module products for sale.

The DA1468x can be used on stand-alone wearables and other rechargeable devices. Its FlexPower feature has "on-demand" resiliency and bank-level security (AES encoding, encryption engine, true random number generator) Is the best IC solution for battery and system power management. It has been applied to IoT sensors and various 3C devices.

Tongwei concluded that the Internet of Things will create huge market opportunities, but the market attributes of the Internet of Things are too fragmented and there are too many standard specifications. Therefore, in order to understand the market potential of the Internet of Things, it is necessary to drive the market to the next stage through innovation. Dialog focuses on the development and innovation of low-power technology, enabling manufacturers to develop small, ultra-low-power wireless networking modules for use in the field of wearable devices and smart homes, which will be the IoT products for big manufacturers. When the promotion is formed, it will help to make the Internet of Things market bigger.

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