The UV-LED light source develops rapidly with the advancement of LED technology. The UV-LED printing lamp is a kind of printing lamp that uses the principle of light curing to dry ink. It has the advantages of small size, low cost, long life, energy saving and environmental protection, instant switch, low temperature operation, and no maintenance. However, UV-LED printed lamps also face the problem of low luminous efficiency, and a large amount of input power is converted into heat, which leads to an increase in junction temperature. In addition, the practical application of UV-LED printed lamps requires harsh heat dissipation, so the design efficiency is high The heat dissipation system is not only the key to the design of high-power UV-LED printed lamp system, but also has high value for the theory research and engineering practice application of the heat dissipation system. At present, domestic and foreign researchers have relatively little research on the design of high-power LED heat dissipation systems. A new type of loop heat pipe has been established to test the thermal conductivity of the loop heat pipe. Experimental results show that the temperature distribution of this loop heat pipe radiator is uniform, and the thermal resistance is small, which can quickly reduce the junction temperature of high-power LEDs. An ultra-bright LED heat dissipation module with excellent heat dissipation capacity. The module uses aluminum with excellent heat conductivity as a heat dissipation substrate, which has achieved good heat dissipation effects. The cooling method of forced air cooling by a small piezoelectric fan is used to reduce the working temperature of the LED. The experimental results show that the cooling method can reduce the LED temperature by 37.4 ℃, proving that the piezoelectric fan is a competitive LED thermal management method.
The traditional convection heat dissipation method is difficult to meet the thermal design requirements of high-power UV-LED printed lamps. This paper designs a heat pipe and air cooling fin heat dissipation scheme. Through simulation and experimental testing, the chips under simulation and experiment are compared and analyzed. The results of junction temperature value and heat sink to ambient thermal resistance value meet the design requirements of the heat dissipation system, and have certain guiding significance for the practical application of forced convection heat dissipation system for high-power UV-LED printed lamps. In order to increase the light output power, a plurality of bare chips are generally packaged on the substrate, and an array type distribution is adopted. Since the thermal resistance of the chip upward conduction is large, the chip upward is approximately insulated. The design and research of the heat dissipation system of the UV-LED printed lamp is a fixed value. Compared with other thermal resistances, the thermal resistance of the radiator is the key factor affecting the junction temperature T of the chip. Therefore, reducing the thermal resistance of the heat sink can reduce the maximum junction temperature of the chip and keep it within a reasonable range, thus meeting the design requirements.
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