IDEC develops new manufacturing method for white LED modules

In the case of blue LED components with a yellow phosphor-based pseudo white LED module, Japan's IDEAC has developed a new manufacturing process that achieves stable quality and simplifies processes, requiring only phosphor-containing gelatinous silicon. The resin sheet is coated on the LED element to heat the LED element, and the LED element can be packaged, and the time required for the packaging process can be shortened to 1/9 as compared with the conventional method of packaging by pouring the liquid resin.

The method of casting the liquid resin to encapsulate is to first form a "dam" for blocking the outflow of the resin around the LED elements on the substrate, then agitating the resin and the phosphor, pouring onto the substrate, and finally performing a heat hardening treatment. In such a manufacturing method, there is a problem in that the resin and the phosphor are not uniformly mixed, the phosphor is precipitated in the resin, and the amount of the resin poured is not large, which causes a problem of unstable quality, and it is difficult to maintain the quality. If the quality of the packaging process is uneven, chromaticity deviation will occur.


A white LED module with a new manufacturing method. The LED element is packaged by heating a gel-like silicone resin sheet containing a yellow phosphor on the blue LED element.

A gel-like silicone resin sheet containing a yellow phosphor. Silicone generally cannot maintain a gel state, and this time it maintains a gel state by improving the molecular structure.

In the new manufacturing method, the gel-like resin sheet is covered on the LED element, heated to about 150 ° C, and the sheet is hardened after 40 minutes, thereby completing the encapsulation. In the past, it took 6 hours to complete the entire packaging process (from dam formation to thermal hardening) by encapsulating the liquid resin. In the new manufacturing method, since the sheet is gel-like, the phosphor does not precipitate, and the quality unevenness in the packaging process is greatly reduced. And production equipment is expected to be greatly simplified.

The gel-like resin sheet was developed by Nitto Denko. Nitto Denko is also selling such sheets to a number of companies Other than Adek. Using this sheet, Adecker established a new manufacturing method and prototyped a white LED module. Adek has concentrated the production of white LED modules for lighting at the Hamamatsu plant and plans to replace all modules with new manufacturing methods in 2013.

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